YoungRae Kim has been an engineer at Amkor Technology Korea for 6 years with responsibility for 2.5D TSV, and high-density fan-out package development. Currently, Kim is working on multi chip packaging development as a project manager.
Prior to joining Amkor, Kim was an engineer at Seoul TechnoPark. During his 3 years dedication at Seoul TechnoPark, Kim spent time doing responsibility for 3D wafer level package development.
Kim received a Master degree in material science from SeJong University, in Korea.
You can hear his presentation at S6. Electropackage System and Interconnect Product(STS)