Dr. Ying Zhang is vice president of Patterning Integration at Applied Materials, Inc. His responsibilities include path-finding, developing, and implementing next-generation patterning integrated solutions and key enabling of Etch, Film, Metrology and other process capabilities and materials engineering to make high volume manufacturing at advanced technology nodes possible.
Prior to joining Applied, Dr. Zhang was a director with TSMC where he managed plasma etching and wet clean for 28 nanometer development and ramp-up to high volume manufacturing. He previously was at IBM’s T.J. Watson Research Center and led the development of dry etch and metallization technologies for multiple advanced nodes and exploratory novel device prototyping beyond the CMOS era.
Dr. Zhang received a Ph.D. in physics from the State University of New York at Albany. He has been recognized with various corporate awards, participated in more than 40 presentations and 100 publications, and holds over 100 issued patents.
You can hear his presentation at S4. Plasma Science and Etching Technology(STS)