Taek-Soo Kim, Ph.D. joined the Department of Mechanical Engineering at KAIST in December 2010. Since then Kim has been directing Advanced Packaging and Thin Film Lab at KAIST (http://aptf.kaist.ac.kr). His research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress/strain induced multiphysics phenomena. Kim received a BS degree in Mechanical Engineering in 2001 from Yonsei University, and MS and PhD degrees in Mechanical Engineering in 2006 and 2010, respectively, both from Stanford University.
You can hear his presentation at S6. Electropackage System and Interconnect Product(STS)