Seung Wook Yoon


Dr. YOON is currently working as director of Advanced Products & Technology Marketing, STATS ChipPAC Pte. Ltd in Singapore. His major interests are for Advanced Packaging and Integration Technology including eWLB/Fanout WLP, SiP and integrated 3D IC packaging.
Prior to joining STATS CHIPPAC LTD, He was deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. YOON received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 250 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Currently working as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.


You can hear his presentation at S6. Electropackage System and Interconnect Product(STS)

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