Kyung W. Paik received the Ph.D. degree from the Cornell University at the department of Materials Science and Engineering in 1989. After the Ph.D. degree, he worked at the General Electric Corporate Research and Development from 1989 to 1995, where he was involved with the R & D of materials and processes of GE High Density Interconnect (HDI) multichip module technology and power I/C packaging as a Senior Technical Staff.
And then, he joined the Korea Advanced Institute of Science and Technology (KAIST) as a professor at the department of Materials Science and Engineering in 1995, and served as the Vice President of Research during 2011 ~ 2013. In his Nano-Packaging and Interconnect Laboratory (NPIL), he has been working in the areas of Anisotropic Conductive Adhesives(ACAs) materials and processing, 3-D TSV NCFs interconnect materials, Epoxy Molding Films for PLP(Panel Level Package), wearable packaging materials and processes, and display packaging technologies. He has published more than 165 SCI journal papers and has more than 40 issued and pending US patents.
Dr. Paik has been members of the IEEE-CPMT, IMAPS, and SEMI. And he also has actively involved in numerous international electronic packaging conferences such as ECTC, IMPACT, EMAP, EPTC, and so on as an organizer, technical committee, international liaison, session chairs and invited speakers.