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Eric NG Hoi Ping

Senior Business Development Engineer
ASM Pacific Technology
 Eric NG, has been business developmentposition at ASMPT for 4years with responsibility of product marketing and development in advanced packagingsector. His main responsible area including advanced interconnect business such as flip chip bonding, TCB bonding, Fan-out wafer and panel level packaging. Prior to joining ASMPT, Eric wasin engineering position forproduct development in semiconductor industry. During his over 10years’experience, Eric spent time doing process and product R&D including FPC (flexible printed circuit), package assembly and thermal cooling solutionfor package device.
Eric received a Bachelor and Master degree in Mechanical Engineeringfield from Hong Kong University of Science and Technology.
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