S4. Plasma Science and Etching Technology

Room 307, COEX Thursday, January 24
1:00pm to 5:00pm

These days the semiconductor business is expanding more rapidly since Big Data and AI (Artificial Intelligence) technologies need plenty of chips as well as processor chips. Two technologies become the most promising ones for the future industry and they will change fundamentally the industrial structure and our normal lives all over the world. The skyrocketing needs for memories makes all chip makers to focus on scale down current DRAM, VNAND new memories. In addition, the high performance processors needs also more scale downed logic chips. As the scaling down is continuing, dry etching technology will confront the process limit eventually so it is the right time to discuss about the new etch technologies for overcoming the limit in this annual SEMICON symposium.

We prepared deep and wide touching on the critical and key etch technologies like new Pulsed Etch, ALE (Atomic Layer Etch), Ultra-high Energy Ion Etch, very-Low Temp. Etch and Etch Simulation technologies. These are essential technologies for solving the scaling down issue and, furthermore, for Big Data and AI era. We invited the academia and industry expertise who can share the vision and solutions for next generation etching technologies- please join us to gain keen insight of future.


  • Date: Jan 24(Thu), 2019
  • Time: 13:00-17:00
  • Room: #307, Conference Room (South), COEX
  • Theme
  • Language: English (Simultaneous interpretation will NOT be provided.)
  • Supported by 



  • Jaesoung Kim (DB HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)


Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won



    *The agenda will be subject to change without notice.
    * Presentation materials agreed by speaker will be distributed via e-mail after the events.
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