02-531-7800

English


S3. Device Technology

Room 317, COEX Wednesday, January 31
1:00pm to 4:50pm

Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 6 speakers from all of the world.

 

  • Date: Jan 31(Wed), 2018
  • Time: 13:00-16:50
  • Room: #317, Conference Room (South), COEX
  • Theme: Challenges to Future Device Technology
  • Language: English (Simultaneous interpretation will NOT be provided​​)
  • Supported by imec

 

Committee

  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (University of Seoul)
  • Sang Gi Lee (Dongbu HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Min Gyu Lim (MagnaChip Semiconductor)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40
   
 13:40-14:10
   
 14:10-14:40
   
 14:40-15:00 Break
   
 15:00-15:40
   
 15:40-16:20
   
 16:20-17:00
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
 
Sponsored by: 
Share page with AddThis