S3. Device Technology

Room 317, COEX Wednesday, January 23
1:00pm to 5:00pm

Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 6 speakers from all of the world.


  • Date: Jan 23(Wed), 2019
  • Time: 13:00-17:00
  • Room: #317, Conference Room (South), COEX
  • Theme
  • Language: English (Simultaneous interpretation will NOT be provided​​)
  • Supported by 



  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (University of Seoul)
  • Sang Gi Lee (DB HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Min Gyu Lim (MagnaChip Semiconductor)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)


Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won



 14:40-15:00 Break
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
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