MI Forum

Room 402, COEX Thursday, February 01
10:00am to 6:00pm

As device technology shrinks to sub-10 nm, we expect a lot of challenges in process integration. Thus, many chip makers are considering EUV lithography to mitigate process risk and to reduce process integration time. However, EUV lithography also has many technical challenges. On the other hand, 3D memory process also brings another technical issue in many aspects. Therefore, we believe the role of Metrology & Inspection is getting more and more important to enable sub-10nm and 3D device.

This year, celebrating its 10th anniversary, MI Forum will cover the theme as “MI: An Enabler of Future Devices” with technical experts from worldwide. We hope you can get better understanding on MI challenges and solutions for upcoming process technologies in the forum and build the network with industry leaders in MI Networking reception, which will be held after the forum as well.


  • Date: Feb 1(Thu), 2018
  • Time: 10:00-18:30
  • Room: #402, Conference Room (South), COEX
  • Theme: MI: An Enabler for Future Devices
  • Language: English and Korean (Simultaneous interpretation will NOT be provided​)​



  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (Dongbu HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Dong Chun Lee (Nanometrics Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)  
  • Sung Hun Lee (Thermo-Fisher MSD Korea)
  • Junwoo Lee (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)



Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 200,000 won 240,000 won 120,000 won
Onsite 240,000 won 280,000 won 150,000 won



 Session 1: EUV
 11:20-11:50 Holistic Patterning Solutions in Leading Edge Semiconductor Device Manufacturing
 11:50-12:20 EUV Reticle Management: From Mask Shop to Fab
Moshe Preil, KLA-Tencor
Philippe Leray, Imec (invited)
(Lunchbox will be provided to attendees.)
 Session 2: 3D
In-Line 3D CD Uniformity Control for Next Generation 3D Memory Devices
Kevin Heidrich, Nanometrics
 Session 3: Collaboration
 16:50-17:20 MI Challenges for Future Devices
Seong-Min Ma, SK hynix (invited)
 17:20-18:00 Panel Discussion
(Forum attendees are invited to networking reception.)
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
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