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Programs Catalog

Programs Catalog

Standards SEMI Korea Office Friday, February 02
2:00pm to 4:30pm

 

  • Program: FPD Metrology Korea TC Chapter Meeting
  • Date: Feb 2(Fri), 2018
  • Time: 14:00-16:30
  • Room: Semi Korea Office

Agenda

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    Japan FPD Metrology Committee
  • 3.2    Taiwan FPD Metrology Committee
  • 3.3    Staff Report

4.0    Ballot Review

  • 4.1    R5633F (New Standard, Test Method for Viewing Angle Characteristic using Mixed Color on Visual Displays)

5.0    Subcommittee & Task Force Reports

  • 5.1    Perceptual Viewing Angle TF
  • 5.2    Perceptual Image Quality TF
  • 5.3    Transparent Display TF

6.0    Old Business

7.0    New Business 

  • 7.1    Discussion for roadmap

8.0    Action Item Review

9.0    Next Meeting and Adjournment

 

 

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Technology Room 301, COEX Friday, February 02
1:00pm to 5:00pm

 

  • Date: Feb 2(Fri), 2018
  • Time: 13:00-17:00
  • Room: #301, Conference Room (South), COEX
  • Language: English & Korean (Simultaneous interpretation will NOT be provided)
  • Organized by KAIST, SL Innovation
  • Supported by SEMI

 

Keynote Speakers

Principle of High Brightness Plasma Beam for FIB System
 
Application of Next Generation FIB System in Microelectronics Application
Prof. Ko DH, Yonsei University
 
Next Generation Focused Ion Beam Using High Density Plasma Beam
Prof. Chang HY, KAIST
 

 


Questions

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Networking Grand Ballroom, 5F, Grand InterContinental Seoul Parnas Wednesday, January 31
5:30pm to 8:00pm

Join more than 400 international participants including leaders and executives from industry, academia, and government in this celebration of our industry and SEMICON Korea. Engage customers, peers, and important decision-makers at this exclusive networking event.

Contact

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Standards Room 305, COEX Thursday, February 01
10:00am to 12:00pm

 

  • Program: Information & Control Korea TC Chapter Meeting
  • Date: Feb 1(Thu), 2018
  • Time: 10:00-12:00
  • Room: #305, Conference Room (South), COEX

Agenda

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    Japan chapter of I&C Technical Committee
  • 3.2    North America chapter of I&C Technical Committee
  • 3.3    Taiwan chapter of I&C Technical Committee

4.0    Staff Report

5.0    Ballot Review

  • 5.1    4946D (Line Item Revisions to SEMI E87-1017, Specification for Carrier Management (Cms) and E87.1-1017 Specification for SECS-II Protocol for Carrier Management (CMS); Adding Carrier Ready to Unload Prediction Feature)
  • 5.2    5832A (New Standard, Specification for Equipment Generic Counter Model, EGCM)
  • 5.3    6301 (Line Item Revision to E142-0211, Specification for Substrate Mapping, Adding packaging raw materials traceability method)

6.0    Subcommittee & Task Force Reports

  • 6.1    GEM300 TF
  • 6.2    DDA TF
  • 6.3    ABFI TF  

7.0    Old Business  

8.0    New Business

9.0    Action Item Review

10.0  Next Meeting and Adjournment


Contact

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HK Kang
Executive VP & Head of Research, Semiconductor R&D Center
Samsung Electronics
Evangelos Eleftheriou
Department Head, Cloud and Computing Infrastructure
IBM
An Steegen
Executive Vice President Semiconductor Technology & Systems
imec
Ivo Bolsens
Sr. VP and CTO
Xilinx
Keynotes Room 401, COEX Wednesday, January 31
10:00am to 12:40pm

 

  • Date: Jan 31(Wed), 2018
  • Time: 10:00-12:40
  • Room: #401, Conference Room (South), COEX
  • Registration: Free
  • Language: Korean and English (Simultaneous interpretation will be provided)

 

REGISTER

Agenda

 10:00-10:40
TBD
 
 
 10:40-11:20
 
 
 11:20-12:00
Quantum Computing
 
 
 12:00-12:40
The Evolution from Chip Performance to System Performance
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
Market Room 318, COEX Thursday, February 01
10:00am to 12:50pm

New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor market. Also, China market is still interesting theme for our industry due to its potential and investment scale. You can explore these issues as well as semiconductor equipment and materials outlook in one place!

 

  • Date: Feb 1(Thu), 2018
  • Time: 10:00-12:50
  • Room: #318, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)
  • Who Should Attend
    • Senior Professionals in Marketing
    • Sales
    • Procurement
    • Business Development
    • Consulting and Product Planning
    • Finance

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 10:00-10:30 The Next Memory Cycle: When, Why, and How it will Happen
  Jim Handy, Objective Analysis
   
 10:30-11:00
  Lung Chu, SEMI China
   
 11:00-11:20 Break
   
 11:20-11:50 Market Dynamics Driving the Future of Automotive Semiconductors
  Jim Feldhan, Semico Research
   
 11:50-12:20
Electronic Materials Trends in a Connected World
 
Mark Thirsk, Linx Consulting
   
 12:20-12:50
  Dan Tracy, SEMI
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
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Technology Room 402, COEX Thursday, February 01
10:00am to 6:00pm

As device technology shrinks to sub-10 nm, we expect a lot of challenges in process integration. Thus, many chip makers are considering EUV lithography to mitigate process risk and to reduce process integration time. However, EUV lithography also has many technical challenges. On the other hand, 3D memory process also brings another technical issue in many aspects. Therefore, we believe the role of Metrology & Inspection is getting more and more important to enable sub-10nm and 3D device.

This year, celebrating its 10th anniversary, MI Forum will cover the theme as “MI: An Enabler of Future Devices” with technical experts from worldwide. We hope you can get better understanding on MI challenges and solutions for upcoming process technologies in the forum and build the network with industry leaders in MI Networking reception, which will be held after the forum as well.

 

  • Date: Feb 1(Thu), 2018
  • Time: 10:00-18:30
  • Room: #402, Conference Room (South), COEX
  • Theme: MI: An Enabler for Future Devices
  • Language: English and Korean (Simultaneous interpretation will NOT be provided​)​

 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (Dongbu HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Dong Chun Lee (Nanometrics Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)  
  • Sung Hun Lee (Thermo-Fisher MSD Korea)
  • Junwoo Lee (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 200,000 won 240,000 won 120,000 won
Onsite 240,000 won 280,000 won 150,000 won

 

Agenda

 10:00-10:10
Welcome
 
 
 10:10-10:50
Keynote
 
 
 
 Session 1: EUV
 10:50-11:20
   
 11:20-11:50 Holistic Patterning Solutions in Leading Edge Semiconductor Device Manufacturing

   
 11:50-12:20 EUV Reticle Management: From Mask Shop to Fab
Moshe Preil, KLA-Tencor
   
 12:20-12:50
TBD
Philippe Leray, Imec (invited)
   
 12:50-14:30
Lunch
(Lunchbox will be provided to attendees.)
   
 Session 2: 3D
 14:30-15:00
In-Line 3D CD Uniformity Control for Next Generation 3D Memory Devices
Kevin Heidrich, Nanometrics
   
 15:00-15:30
   
 15:30-15:50
Break
   
 15:50-16:20
   
 16:20-16:50
   
 Session 3: Collaboration
 16:50-17:20 MI Challenges for Future Devices
Seong-Min Ma, SK hynix (invited)
   
 17:20-18:00 Panel Discussion
   
 18:00-19:00
(Forum attendees are invited to networking reception.)
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
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Networking Room 402, COEX Thursday, February 01
6:00pm to 7:00pm

MI Reception is a special event for MI industry to build the global networking through supply chain and to get together for business opportunities. More than 200 people including MI Forum attendees, speakers and MI Committee members are expected to attend.

 

Contact

 

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STS Room 307, COEX Thursday, February 01
9:00am to 11:45am

This short course tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.

 

  • Date: Feb 1(Thu), 2018
  • Time: 09:00-11:45
  • Room: #307, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 100,000 won 120,000 won 50,000 won
Discounted with S4 80,000 won 100,000 won 30,000 won
Onsite 120,000 won 150,000 won 80,000 won
Discounted with S4 100,000 won 120,000 won 50,000 won

 

Agenda

  09:00-09:45
   
  09:45-10:00 Break
   
 10:00-10:45
   
 10:45-11:00 Break
   
 11:00-11:45
TBD
Prof. Geun Young Yeom, Sungkyunkwan University
 
*The agenda will be subject to change without notice.
*Proceeding will be provided at onsite.
View Full Agenda
STS Room 307, COEX Wednesday, January 31
1:00pm to 6:00pm

Advanced Lithography session of the STS 2018 will offer the opportunities to review the latest trends in the mainstream lithography technologies under the theme of "EUV High Volume Manufacturing and Beyond".

Recently there are a lot of progresses achieved in EUV and as a result EUV is getting considered as a manufacturing means more seriously than before. For the sake of the solid migration to the manufacturing phase, the readiness of each component of EUV will be reviewed during this meeting including overview, exposure tools, optics, material, mask, and process by the prominent leading figures of the corresponding area. In addition, the next generation EUV technologies like high-NA EUV and EUV double pattering will be discussed to disclose the potential issues and to prepare collaboratively throughout the industry.

 

  • Date: Jan 31(Wed), 2018
  • Time: 13:00-18:00
  • Room: #307, Conference Room (South), COEX
  • Theme: EUV High Volume Manufacturing and Beyond
  • Language: English (Simultaneous interpretation will NOT be provided)​​
  • Supported by imec

 

Committee

  • Shangwon Kim (Dongbu HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40
 
 
 13:40-14:20
TBD
Philippe Leray, Imec
 
 
 14:20-14:40
TBD
Andrew Grenville, Inpria
 
 
 14:40-15:00
 
 
 15:00-15:20
Break
 
 
 15:20-16:00
 
 
 16:00-16:20
 
 
 16:20-16:40
 
 
 16:40-17:00
Break
 
 
 17:00-17:20
 
 
 17:20-17:40
 
 
 17:40-18:00
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
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STS Room 308, COEX Wednesday, January 31
1:00pm to 5:00pm

In this session, we will be able to share the most up-to-date research and development results in the field of Advanced Materials and Process Technology which are the key enablers of the future semiconductor devices. Many prominent authors from the academia and industries will cover various functional materials research area and semiconductor devices not only in the view point of the fundamental but also for the mass production. Especially, topics regarding material innovation for semiconductor application will be highlighted and technical challenges for mass production will be discussed. Excellent 8 presentations including 3 outstanding invited talks will be given and will cover the major technical issues and the leading edge solutions.

 

  • Date: Jan 31(Wed), 2018
  • Time: 13:00-17:00
  • Room: #308, Conference Room (South), COEX
  • Theme: Advanced Materials & Technologies for Future Semiconductor Devices
  • Language: English (Simultaneous interpretation will NOT be provided)​​
  • Supported by imec

 

Committee

  • Si Bum Kim (MagnaChip Semiconductor)
  • Hyoungyoon Kim (Dongbu HiTek)
  • Jae Sung Roh (Yonsei University)
  • Kiseon Park (SK hynix)
  • Hyun Chul Sohn (Yonsei University)
  • Gill Lee (Applied Materials)
  • Marco Lee (Lam Research Korea)
  • Jong Min Lee (Eugene Technology)
  • In Gon Lim (Digital Imaging Technology)
  • HanJin Lim (Samsung Electronics)
  • Ji Hyun Choi (Tokyo Electron Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40 TBD

Prof. Sayeef Salahuddin, UC Berkeley (invited)
   
 13:40-14:00
   
 14:00-14:20
   
 14:20-14:40
   
 14:40-15:00 Break
   
 15:00-15:40
Area-selective Atomic Layer Deposition of SiO₂ and Ru for Self-aligned Fabrication
   
 15:40-16:00
   
 16:00-16:40
 
 
 16:40-17:00
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
STS Room 317, COEX Wednesday, January 31
1:00pm to 4:50pm

Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 6 speakers from all of the world.

 

  • Date: Jan 31(Wed), 2018
  • Time: 13:00-16:50
  • Room: #317, Conference Room (South), COEX
  • Theme: Challenges to Future Device Technology
  • Language: English (Simultaneous interpretation will NOT be provided​​)
  • Supported by imec

 

Committee

  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (University of Seoul)
  • Sang Gi Lee (Dongbu HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Min Gyu Lim (MagnaChip Semiconductor)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40
   
 13:40-14:10
   
 14:10-14:40
   
 14:40-15:00 Break
   
 15:00-15:40
   
 15:40-16:20
   
 16:20-17:00
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
 
View Full Agenda
STS Room 307, COEX Thursday, February 01
1:00pm to 5:30pm

These days the semiconductor business is expanding more rapidly since Big Data and AI (Artificial Intelligence) technologies need plenty of chips as well as processor chips. Two technologies become the most promising ones for the future industry and they will change fundamentally the industrial structure and our normal lives all over the world. The skyrocketing needs for memories makes all chip makers to focus on scale down current DRAM, VNAND new memories. In addition, the high performance processors needs also more scale downed logic chips. As the scaling down is continuing, dry etching technology will confront the process limit eventually so it is the right time to discuss about the new etch technologies for overcoming the limit in this annual SEMICON symposium.

We prepared deep and wide touching on the critical and key etch technologies like new Pulsed Etch, ALE (Atomic Layer Etch), Ultra-high Energy Ion Etch, very-Low Temp. Etch and Etch Simulation technologies. These are essential technologies for solving the scaling down issue and, furthermore, for Big Data and AI era. We invited the academia and industry expertise who can share the vision and solutions for next generation etching technologies- please join us to gain keen insight of future.

 

  • Date: Feb 1(Thu),2018
  • Time: 13:00-17:30
  • Room: #307, Conference Room (South), COEX
  • ThemeNovel Plasma Process Technologies for Next Generation Devices
  • Language: English (Simultaneous interpretation will NOT be provided.)
  • Supported by imec

 

Committee

  • Jaesoung Kim (Dongbu HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40
 
 
 13:40-14:10
 
 
 14:10-14:50
 
 
 14:50-15:20
 
 
 15:20-15:40
Break
 
 
 15:40-16:00
 
 
 16:00-16:40
 
 
 16:40-17:10
 
 
 17:10-17:30
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
STS Room 308, COEX Thursday, February 01
1:00pm to 5:00pm

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. 

 

  • Date: Feb 1(Thu), 2018
  • Time: 13:00-17:00
  • Room: #308, Conference Room (South), COEX
  • Theme: CMP & Cleaning for Emerging Technology
  • Language: English (Simultaneous interpretation will NOT be provided​)​
  • Supported by imec

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Ho Youn Kim (Dongbu HiTek)
  • Jin-Goo Park (Hanyang University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won
 
Co-organized by   Korea CMP UGM
  Korea Surface Cleaning UGM (KSCUGM)

 

Agenda

 Session 1: CFM Technology
 
 13:00-13:40
   
 13:40-14:00
   
 14:00-14:20
   
 14:20-14:40
   
 14:40-15:00 Break
   
 Session 2: CMF Technology
 
 15:00-15:40
Recent Trend of CMP Equipment Platform and its Requirement of Processes and Consumables: BEOL CMP
   
 15:40-16:00
   
 16:00-16:20
   
 16:20-16:40
   
 16:40-17:00
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
STS Room 317, COEX Thursday, February 01
1:00pm to 6:25pm
As packaging, wafer level and heterogeneous system assembly in general, electronic systems for future mobility, 5G, AI and Automotive are targeting to find solutions for those key critical aspects of packaging: Performance, Flexibility and Cost competitiveness. Those solutions will make huge connection among system and system such as sensor and logic, logic and memory, antenna and logic. So we are expecting to make a new vision era how packaging as a SIP, FOWLP, 3D IC, and 2.5D IC will open to new market as a heart of 4th industry generation. To address those, chip-packaging-system interaction needs to be better understood. The experts of device design, FABs engineering, packaging, and system need to move closer together. Materials and Equipments need to be developed and tested for electronic systems. Those are the challenging but this session is helping to share the recent advanced packaging information.

 

  • Date: Feb 1(Thu),2018
  • Time: 13:00-18:25
  • Room: #317, Conference Room (South), COEX
  • Theme: Advanced Packaging in a New Era
  • Language: English (Simultaneous interpretation will NOT be provided)​​
  • Supported by imec

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • Hogeon Song (Samsung Electronics)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (Dongbu HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • CS Han (ASE Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:30
TBD
Santosh Kumar, Yole Development
 
 
 13:30-14:00
 
 
 14:00-14:20
 
 
 14:20-14:40
 
 
 14:40-15:00
Break
 
 
 15:00-15:30
TBD
Charlie Cha, NVIDIA Korea (invited)
 
 
 15:30-15:55
 
 
 15:55-16:15
 
 
 16:15-16:35
 
 
 16:35-16:55
Break
 
 
 16:55-17:25
 
 
 17:25-17:45
TBD
ASE
 
 
 17:45-18:05
 
 
 18:05-18:25
Via-frame Fan-out WLP Technology as Packaging Solution for Smart Things
Tae-Hoon Kim, nepes
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
SMART Room 402, COEX Wednesday, January 31
2:00pm to 5:30pm
Smart automotive is driving a new market for semiconductor. Connected car and autonomous driving system need integrated system, advanced safety features, and infortainment- the value of chips are getting higher than ever in car industry. In a road to smart driving, the challenge of smart automotive is the challenge of semiconductor. As the industry expects to make a fully autonomous car by 2030, the collaboration with semiconductor industry will be essential. This forum will figure out how smart automotive are changing our driving experience and how the semiconductor plays the key role in the new smart world.

 

  • Date: Jan 31(Wed), 2018
  • Time: 14:00-17:30
  • Room: #402, Conference Room (South), COEX
  • Theme: Drive Smart
  • Language: Korean and English (Simultaneous interpretation will be provided)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 180,000 won 200,000 won 100,000 won
Onsite 200,000 won 240,000 won 120,000 won

 

Agenda

 14:00-14:10
Opening
   
 14:10-14:40
   
 14:40-15:10
Keynote 2: Mobility Solutions for Automated Driving
Klaus Meder, Bosch
   
 15:10-15:40
   
 15:40-16:00
Break
   
 16:00-16:30
   
 16:30-17:00
   
 17:00-17:30
   
 17:30
Adjourn
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
SMART Room 301, COEX Thursday, February 01
1:00pm to 4:30pm

Technology is evolving at lightning speed – faster than ever before. The increasing adoption of IoT technologies, robotics, automation, software and data analytics means that virtually all industries and sectors are set to experience significant change. Even semiconductor industry which is well-known as highly automated manufacturing also continues to pursue smarter solutions in order to overcome various new challenges in an increasingly complexed fab operation environment.

In this forum, presenters from all over the world will share their insights on the latest trends and emerging technologies in Smart Manufacturing areas such as IoT, Cloud Computing, Big Data, Machine Learning, and Artificial Intelligence focusing on implications in semiconductor industry. They will also illustrate the benefits of realizing “Smart Manufacturing” through the adoption of new methods, new systems, and new solutions.

 

  • Date: Feb 1(Thu), 2018
  • Time: 13:00-16:30
  • Room: #301, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:30
 
 
 13:30-14:00
 
 
 14:00-14:30
 
 
 14:40-15:00
Break
 
 
 15:00-15:30
 
 
 15:30-16:00
TBD
Schneider Electric
 
 
 16:00-16:15
Smart Manufacturing & SEMI (tentative)
Tom Salmon, SEMI HQ
 
 
 16:15-16:30
Q&A
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
Technology Room 318, COEX Wednesday, January 31
1:00pm to 5:10pm

The 5G and Big Data, key issues in next connected world are increasing demand for putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. To address these challenges, test industry is struggling with increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware. In this Test Forum, you can get the clues to overcome these challenges from industry expertise.

 

  • Date: Jan 31(Wed), 2018
  • Time: 13:00-17:10
  • Room: #318, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Young-Kwan Ko (UniTest)
  • James Jin-Soo Ko (Teradyne)
  • Kwonsung Ban (Samsung Electronics)
  • JeongBeom Bae (FormFactor Korea)
  • Sokyoung Song (SK hynix)
  • Kyu-hyuk Yeon (ASE Korea)
  • MinHo Chang (Amkor Technology Korea)
  • YH Jeon (TSE)
  • Jeongho Cho (Advantest Korea)

 

REGISTER

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 13:00-13:40
   
 13:40-14:10
5-Gen, RF Testing Solution
Sungjong Park, Advantest
   
 14:10-14:40
   
 14:40-15:00 Break
   
 15:00-15:40
   
 15:40-16:10
   
 16:10-16:40
TBD
Ken Lanier, Teradyne
   
 16:40-17:10
 
*The agenda will be subject to change without notice.
* Presentation materials agreed by speaker will be distributed via e-mail after the events.
View Full Agenda
Networking Room 403, COEX Wednesday, January 31
12:40pm to 1:30pm

Contact

View Full Agenda
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