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Welcome Message from STS 2018 Chairman

I would like to extend thanks to all the participants in the semiconductor industry and the invited speakers to the SEMICON Korea STS 2018.

We are living through challenging times. In 2017, Global economic recovery has been slow and uneven. Also geo-political risk has increased uncertainty in the world. In parallel, we are seeing a paradigm shift in both economic and social terms as we experience a 4th industrial revolution, sweeping away old assumptions and subjecting us all to a new intensity of competition.

Rapidly evolving information and communication technology is serving as an enabler for connection and convergence technologies that help build a complex network among people and objects. The commercialization or 5G technology, the advancement of machine learning based artificial intelligence, and the wider adoption of cloud and big data are further accelerating our transition into a new industrial era, dubbed the 4th industrial revolution.

For the successful leadership in rapidly changing environment, the competence by oneself is not sufficient to solve the problem. Sustainable growth can be achieved by obtaining the best technical skills and competitiveness through the collaboration of device makers, equipment and materials company.

In light of such situations, meaningful theses form six different areas of Lithography, Interconnection, Device, Etch, Contamination Free Manufacturing & CMP and Package will be announced at the SEMICON Korea STS 2018, for us learn about various new technologies while gaining insight into the development direction of the next generation semiconductor technology. We hope that participants will be able to gather valuable knowledge again this year.

Finally, we sincerely appreciate the contributions of all of the Committee Members, the executives and staffs of SEMI for their special effort to make this event a success. We ask you to the generous support for development of semiconductor industry continuously.

Ho-Kyu Kang Photo

Program Chairman of SEMICON Korea STS 2018
Samsung Electronics Semiconductor R&D Center
Executive VP & General Manager, Ho-Kyu Kang


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Plasma & Etching Tutorial

This short course tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.

 

S2. Advanced Materials & Process Technology

In this session, we will be able to share the most up-to-date research and development results in the field of Advanced Materials and Process Technology which are the key enablers of the future semiconductor devices. Many prominent authors from the academia and industries will cover various functional materials research area and semiconductor devices not only in the view point of the fundamental but also for the mass production.

S4. Plasma Science and Etching Technology

These days the semiconductor business is expanding more rapidly since Big Data and AI (Artificial Intelligence) technologies need plenty of chips as well as processor chips. Two technologies become the most promising ones for the future industry and they will change fundamentally the industrial structure and our normal lives all over the world. The skyrocketing needs for memories makes all chip makers to focus on scale down current DRAM, VNAND new memories.

S5. Contamination-free Manufacturing and CMP Technology

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication.

S6. Electropackage System and Interconnect Product

As packaging, wafer level and heterogeneous system assembly in general, electronic systems for future mobility, 5G, AI and Automotive are targeting to find solutions for those key critical aspects of packaging: Performance, Flexibility and Cost competitiveness. Those solutions will make huge connection among system and system such as sensor and logic, logic and memory, antenna and logic.
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